详细介绍
Speicification:
Inspection System & Optical System
Inspection Object |
Skew / Tombstone / Wrong part / Missing / Overturning / Damaged / |
Inspection Component |
0201 chip , IC pitch 0.3mm, wave soldering point |
Inspection Method |
Color image comparison, OCR, IC Short Analysis, Graphics Similarities Analysis, Color Analysis, Gray Analysis |
Camera |
Color CCD (2M) , Resolution 15um, FOV 24x18mm, Speed <=2000 mm2/s |
Light Source |
RGB cascade multi-angle LED combination lighting, high brightness, 2M pixels tele-centric lens, DOV:8mm |
Software & Computer
Inspection capability |
120 points/sec ; programming time : 1-1.5 hr/1000 components, NG inspection rate >99% |
Mark Recognition |
2 points, support multi-board multi-mark points, support bad mark ; Process speed 0.5sec/pcs |
Computer |
Dual core 2.7G, DDR II 2.0G, 500G harddisk, 22" wide screen LCD |
Mechanical System
PCB Thickness |
0.3 - 3.0 (PCB Warpage < 2mm) |
PCB Height |
Top: 30mm, Bottom 35mm (can be customized) |
Driving Method |
AC Servo Motor + ball screw rod + linear guide rail |
Motion Speed |
Max 700mm/s |
PCB Size |
380 x 380mm, Auto-width adjustment |
Conveyor Height |
900 +/- 20mm |
Power |
AC220V / 50Hz, 650W, UPS 1000 VA |
Compressed Air |
Max 0.3MPa |
Dimension |
980 x 1080 x 1410 mm (exclude Towerlight) ; Towerlight height 550mm |
Weight |
600kg |