Surface temperature of components
|
Pre-heat stage |
130〜180℃ 60〜90sec. |
|
Reflow stage |
Over 220℃ 30〜90 seconds. |
|
Peak temperature stage |
240〜250℃ within 10 seconds. |
• Solder composition : Sn-Ag-Cu solder
• Repetition : up to 2 times
Cooling between the two reflows is required.
Source: Susumu Co, Ltd