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Recommended reflow temperature profile

Surface temperature of components

Pre-heat stage

130〜180℃ 60〜90sec.

Reflow stage

Over 220℃ 30〜90 seconds.

Peak temperature stage

240〜250℃ within 10 seconds.

•    Solder composition : Sn-Ag-Cu solder
•    Repetition : up to 2 times
Cooling between the two reflows is required.

Source: Susumu Co, Ltd